Product Description
HY-9055 is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time.
Application
HY-9055 is suitable for bonded seal of electronic components, power module and control module, LED invertor potting, etc which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB, substrate, etc.
Technical Parameters
Certifications
Detailed Images
Contact
HY-9055 is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time.
Application
HY-9055 is suitable for bonded seal of electronic components, power module and control module, LED invertor potting, etc which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB, substrate, etc.
Technical Parameters
Certifications
Detailed Images
Contact